Common Devices Under Test

Products commonly undergoing UFS physical layer testing include:

• Smartphone SoCs (Application Processors)
• UFS Controller Chips
• UFS Storage Devices (UFS NAND)
• Storage Modules (e.g., UFS Cards or BGA-packaged modules)
• UFS Interfaces within Automotive Infotainment Systems

UFS Test Specifications

Key test specifications include:

• Electrical Characteristics: Such as voltage swing, steady-state levels, signal impedance matching, etc.
• Timing Parameters: Including data setup time, hold time, clock skew, etc.
• Signal Integrity: Such as eye diagram quality, jitter, crosstalk, etc.
• Environmental Requirements: Such as the impact of temperature, humidity, and power supply noise on testing.

Common UFS Physical Layer Signal Integrity Test Items

Physical layer signal integrity testing encompasses several key test items, including but not limited to:

• Eye Diagram Test
• Jitter Analysis (Jitter Measurement)
• Return Loss & Insertion Loss
• Clock Recovery Capability Test
• Receiver Sensitivity Test (Tolerance to SJ, RJ, PJ)
• Transmitter (TX) Voltage Swing and Template Mask Test
• SSC (Spread Spectrum Clocking) Test

Commonly Used Test Instruments

The following instruments are typically used for UFS physical layer testing:

• High-Speed Oscilloscopes (e.g., Keysight Infiniium UXR Series, Tektronix DPO/MSO Series): Used for eye diagram and jitter analysis.
• Bit Error Rate Testers (BERT): Used for bit error rate and receiver sensitivity testing.
• Vector Network Analyzers (VNA): Used for insertion loss and return loss testing.
• Protocol Analyzers: Used for upper-layer protocol verification in conjunction with physical layer tests.

Test Report