As storage chip speeds continue to upgrade, the Interposer used in physical layer signal characterization has become a core challenge in chip verification. The CLAUDE SIGLINK series Interposer is specifically designed to address this challenge, covering DRAM and NAND FLASH testing requirements.

View Detail >>

As storage chip speeds continue to upgrade, the Interposer used in physical layer signal characterization has become a core challenge in chip verification. The CLAUDE SIGLINK series Interposer is specifically designed to address this challenge, covering DRAM and NAND FLASH testing requirements.

View Detail >>

As storage chip speeds continue to upgrade, the Interposer used in physical layer signal characterization has become a core challenge in chip verification. The CLAUDE SIGLINK series Interposer is specifically designed to address this challenge, covering DRAM and NAND FLASH testing requirements.

View Detail >>

As storage chip speeds continue to upgrade, the Interposer used in physical layer signal characterization has become a core challenge in chip verification. The CLAUDE SIGLINK series Interposer is specifically designed to address this challenge, covering DRAM and NAND FLASH testing requirements.

View Detail >>

To meet customers' flexible needs in high-speed digital signal testing, our company now offers professional test site rental services, providing a one-stop solution from hardware equipment to technical support. The service targets IC design companies, system manufacturers, and research institutions, and is suitable for product verification, performance evaluation, and short-term testing projects.

View Detail >>

To meet customers' diverse testing needs during R&D, verification, and failure analysis phases, our company provides a full range of high-speed digital signal test equipment for rental. This includes high-bandwidth oscilloscopes, high-performance fixtures, and various types of probes. Through flexible rental solutions, customers can quickly deploy advanced testing equipment without substantial upfront investment, accelerating project progress and improving testing efficiency.

View Detail >>

In high-speed digital signal testing, reliable and precise connection methods are crucial for ensuring measurement quality. We not only provide comprehensive high-speed digital signal testing services but also independently design and sell a variety of high-performance test fixtures and accessories, specifically optimized to meet the connectivity demands in high-speed signal integrity validation. Our test fixtures cover a wide range of application scenarios, including but not limited to high-speed SerDes interfaces, DDR, PCIe, USB, MIPI, and other standards. The products support high-bandwidth, low-loss transmission, and feature excellent Return Loss and Insertion Loss performance, meeting the stringent requirements of laboratory, R&D, and mass production environments.

View Detail >>

In high-speed digital signal testing, signal integrity is critical. To meet customers' needs for high-frequency and high-precision measurements, we not only provide professional testing services but also simultaneously offer high-performance test accessories and probes, helping engineers accurately reproduce real signals. We have carefully selected and independently developed a range of probe products suitable for various testing scenarios. These include differential probes, single-ended probes, high-end models with bandwidths up to tens of GHz, as well as customized accessories compatible with multiple connection methods. Our products are widely applicable for signal debugging and validation of high-speed interfaces such as SerDes, PCIe, USB, DDR, HDMI, and more.

View Detail >>

View Detail >>

View Detail >>

View Detail >>

With the continuously increasing bandwidth demands of network devices, Ethernet technology has evolved from traditional megabit speeds to gigabit, 10G, 25G, 40G, and even higher rates. High-speed Ethernet faces more stringent signal integrity challenges at the physical layer, making systematic testing and validation a crucial step in ensuring product quality and compatibility. ETHERNET Testing Overview Ethernet testing primarily targets the data link and physical layers. At the physical layer, signal integrity testing focuses on whether signals are affected by interference, attenuation, reflection, or crosstalk during transmission, ensuring data can be received accurately and without errors at high speeds. Testing covers multiple parameters in both the time and frequency domains, making it an indispensable part of product development, certification, and pre-production phases.

View Detail >>

DP Testing Overview DisplayPort (DP) is a high-bandwidth digital video interface standard developed by VESA (Video Electronics Standards Association). It is widely used in computer monitors, televisions, graphics cards, and consumer electronics. With successive iterations of the DP standard (e.g., DP 1.2, 1.4, 2.0), its transmission rates have continually increased, placing greater demands on physical layer signal integrity. DP physical layer testing aims to ensure that high-speed signals maintain stable, low-bit-error-rate transmission performance even in complex interconnect environments.

View Detail >>

UFS Testing Overview: Universal Flash Storage (UFS) is a high-performance embedded storage interface standard widely used in devices such as smartphones, tablets, and automotive electronics. With the development of newer versions like UFS 3.x and UFS 4.0, its data transfer rates have reached multi-Gbps levels, placing higher demands on signal integrity. Physical layer testing for UFS is a crucial step in ensuring system stability and data integrity, particularly critical in high-speed transmission environments.

View Detail >>

HDMI Testing Overview: High-Definition Multimedia Interface (HDMI) is a high-speed digital interface widely used among consumer electronics, computers, and display devices. With the continuous increase in resolution and data rates, the demands on HDMI signal integrity have also grown significantly. The purpose of HDMI physical layer testing is to verify that signals maintain sufficient quality during high-speed transmission, ensuring the stable transfer of image and audio signals.

View Detail >>

USB Testing Overview: USB (Universal Serial Bus) is one of the most widely used high-speed serial communication interfaces, extensively applied in computers, consumer electronics, mobile devices, and industrial sectors. With the evolution from USB 2.0 and USB 3.x to USB4 standards, data transfer rates have increased from 480 Mbps to 40 Gbps, significantly raising the requirements for signal integrity. USB physical layer testing aims to evaluate the quality of high-speed signals during actual transmission, ensuring they operate within the standard specifications to guarantee data stability and system reliability.

View Detail >>

MIPI Testing Overview: MIPI (Mobile Industry Processor Interface) is a high-speed, low-power interface standard widely used in mobile devices (such as smartphones, tablets), embedded systems, and IoT devices. MIPI physical layer signal integrity testing aims to verify the signal transmission quality of the interface, ensuring its stability, anti-interference capability, and reliability during high-speed data transfer, thereby meeting the stringent performance requirements of mobile devices.

View Detail >>

PCIe Testing Overview: PCI Express (PCIe) is a high-speed serial computer expansion bus standard widely used in motherboards, graphics cards, SSDs, network cards, and other high-speed communication devices. As data transfer rates have evolved from Gen1 (2.5 GT/s) to the currently mainstream Gen5 (32 GT/s) and the advancing Gen6 (64 GT/s), physical layer signal integrity testing has become a critical step in ensuring device interoperability and stability.

View Detail >>

DDR Testing Overview: DDR (Double Data Rate) memory technology is the current mainstream storage solution, widely used in computers, servers, mobile devices, and embedded systems. DDR testing aims to verify the physical layer performance of memory modules or memory interfaces, ensuring that their signal integrity, timing accuracy, and electrical characteristics under high-speed data transmission meet design requirements.

View Detail >>